n a new report coming from supply chain analyst Ming-Chi Kuo, Apple is gearing up to kick off the mass production of its M5 family of chipsets in 2025. As per reports, the tech giant will use TSMC’s advanced 3nm semiconductor node (N3P) in this new generation of chipsets. The chipsets are reported to deliver increased efficiency and high performance as compared to their predecessors.

As per Ming-Chi Kuo, Apple will start the mass production of the M5 chipset in 2025 followed by the fabrication stage until 2026. The M5 chipsets will be followed by M5 Pro, M5 Pro Max, and M5 Ultra variants.

What’s more, the tech giant might step away from its fully integrated SocC and this would lead to a major design change in Apple’s upcoming M5 Pro chipset. This will deviate from the conventional system-on-chip architecture. The analyst further suggests that the shift from the conventional approach and going towards the novel approach means that it will separate the Central Processing Unit (CPU) and Graphics Processing Unit (GPU).

However, there are two primary objectives that are leading toward this shift:

• Enhanced performance
• Improved production yields.

This advanced method boasts several benefits, including:

Improved Thermal Performance which will result in extended periods of usage without overheating, ensuring increased and clutter-free performance.

Another benefit is the Reduced manufacturing defects resulting in high quality chips and it will also help in decreased production loss.

As per reports, this unconventional design will take 30-50 percent less space than older chips. The new design will be integrated not only into the M5 Pro but also into the M5 Max and M5 Ultra variants. The m5 chip will be rolled out in the first half of 2025. However, the M5 Pro, M5 Pro Max, and M5 Ultra will be rolled out in the early phases of 2026.